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Articles

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Challenges for Step Stencils with Design Guidelines for Solder Paste Printing

Carmina Läntzsch LaserJob GmbH Fürstenfeldbruck, Germany Georg Kleemann LaserJob GmbH Fürstenfeldbruck, Germany Abstract The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: “faster and smaller” it is necessary to place components with different paste volume close together without regard to solder paste printing. [...]

By | October 10th, 2015|PCB Manufacture|Comments Off on Challenges for Step Stencils with Design Guidelines for Solder Paste Printing

Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles

Craig Hillman1, Nathan Blattau1, Matt Lacy2 1 DfR Solutions, Beltsville, MD 2 Advanced Energy Industries, Fort Collins, CO Abstract Solder joint reliability of SMT components connected to printed circuit boards is well documented. However, much of the testing and data is related to high-strain energy thermal cycling experiments relevant to product qualification testing [...]

By | October 10th, 2015|PCB Manufacture|Comments Off on Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles

PCB Surface Finishes: A General Review

By Jun Nable, Ph.D. Introduction Surface finishing is an integral part of any Printed Circuit Board (PCB) or Printed Wiring Boards (PWB) fabrication. It is generally applied to exposed Cu connectors and conductors on the PCB. Surface finishing has numerous important functions. It serves as a protective layer for the Cu connectors during storage. The surface [...]

By | October 9th, 2015|PCB Manufacture|Comments Off on PCB Surface Finishes: A General Review

Henny Youngman’s advice to PCB designers

By Richard Goering   Richard Goering, senior manager of technical communications, CadenceRichard Goering is senior manager of technical communications at Cadence Design Systems. As an editor for Computer Design, EE Times, and SCDsource, he has been writing about EDA and IC design for 25 years. From the 1930s to the 1980s, comedian Henny Youngman was [...]

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Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Brent Fischthal, Sr. Marketing Manager, Products & Solutions Michael Cieslinski, Engineering Manager Panasonic Factory Solutions Company of America Rolling Meadows, Illinois Abstract The printed circuit board assembly industry has long embraced the “Smaller, Lighter, Faster” mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, [...]

By | October 8th, 2015|PCB Manufacture|Comments Off on Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Cleaning PCBs in Electronics: Understanding today’s Needs

P.J.Duchi, Anne-Marie Laügt, Marie Verdier, G.Abidh Inventec Performance Chemicals Bry sur Marne, France Abstract Because of the phase out of CFC’s and HCFC’s, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solu- [...]

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Eight steps for efficient PCB manufacturing and assembly – Part 2

By Michael Ford Second in a two-part series, describing critical rules that should underpin PCB manufacturing, and how new technologies overcome increasing complexity. In the first part of this series, we looked at the first four of the eight crucial steps that will help you achieve truly effective printed circuit board (PCB) manufacturing [...]

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Eight steps for efficient PCB manufacturing and assembly(part 1)

  PCB manufacturing and assembly is a crucial stage that stands between the design of every technology device and the finished product. Critical business metrics - cost, quality, delivery, etc. - are directly affected by the quality of the manufacturing process. Today, PCB manufacturing performance and productivity are under threat as customers’ delivery [...]

By | October 8th, 2015|PCB Manufacture|Comments Off on Eight steps for efficient PCB manufacturing and assembly(part 1)